Plasmon-empowered Closed-loop Theranostics for Chronic Wound Biofilms

Objective

Chronic wounds affect millions of people worldwide, consume 1–3% of healthcare spendings in developed countries, and cause amputations and death. More than 60% of these wounds contain bacterial biofilms, which are treatment-resistant bacterial communities that impede healing and increase the incidence of medical complications. Current biofilm treatments are ineffective due to delayed treatment, lack of specificity toward the infecting biofilm, and poor performance against biofilm defenses. This project addresses these challenges by developing an all-optical wound dressing that integrates molecular diagnostics and therapy (theranostics) in a closed-loop format, enabling treatment guided by real-time diagnostic feedback. These dressings incorporate plasmonic nanoparticles that serve dual roles: confining light for molecular sensing via surface-enhanced Raman spectroscopy (SERS) and converting light into heat (thermoplasmonics) for therapy. The research will pursue three aims: (1) establish a nanomanufacturing strategy for dressing fabrication; (2) design a multistep therapeutic approach based on controlled heating via integrated temperature feedback; and (3) demonstrate closed-loop therapy guided by diagnostic feedback, benchmarking outcomes against unguided treatments. Together, these aims will validate the feasibility of molecularly informed, closed-loop biofilm management. In the long term, this work will lay the foundation for next-generation wearable and implantable theranostic devices, extending beyond wound care to enable dynamic, molecularly-informed management of various medical conditions. The project combines the host lab’s expertise in thermoplasmonics with the candidate’s complementary background in SERS and nanoengineering. The fellowship will support the candidate’s career development by advancing skills in thermoplasmonics, strengthening interdisciplinary and clinical collaborations, and enhancing leadership, management, and networking capacity.